wafer是什么意思 water中文怎么读

OD stands for the thin oxide region or active area.

STI stands for shallow trench isolation (opposite of OD)

In an OD NWELL resistor the resistor is formed in an active area. In the case of an STI NWELL resistor it is formed under the STI oxide.

The models for these two resistors will be different since they will have differnt diffusion profiles and be contacted different. The OD resistor most likely has a silicide block mask also to keep silicide from forming on top of the OD region.

• ESC: Electrical Static Chuck 静电卡盘

• TMP: Turbo Molecule Pump 分子泵

• DP: Dry Pump 干泵

• EPD: Endpoint Detection 终点检测系统

• OES: Optical Emission Spectrograph 光学发射光谱仪

• IEP: Interferometer Endpoint Detection 干涉测量仪

• CTC: Cluster Tool Controller 群集设备控制器

• PMC: Process Module Controller 工艺模块控制器

• TMC: Transfer Module Controller 传送模块控制器

. BT: Break Through 去除自然氧化层

• ME: Main Etch 主刻

• OE: Over Etch 过刻

• STI: Shallow Trench Isolation 浅沟槽隔离刻蚀

• PR: Photo Resist 光刻胶

• CD: Critical Dimension 关键尺寸

• AEI: After Etch Inspection

• ADI: After Developed Inspection

• ROX: Remaining Oxide 剩余Oxide层厚度

• ER: Etch Rate 刻蚀速率

• EU: Etch Uniformity 刻蚀均匀性

• AEC/APC: Advanced Equipment/Process Control 先进设备/工艺控制

• PRK: Particle Reduce Kits 减少颗粒过程

• PM: Periodic Maintenance 周期维护

• CoO: Cost of Ownership

• CoC: Cost of Consumption

• PRS: Process Release Standard

• STR: Split testing release

• MSTR: Mass Split Testing Release

• WAT: Wafer Acceptance Test

• Fab: Fabrication 芯片加工厂代称

• FA: Fab Automation 工厂自动化

• CIM: Computer Integration Manufacturing 计算机集成制造

1

WAT

Wafer Acceptance Test /晶圆测试

2

RF

Radio Frequency /射频

3

CD

Critical Dimension /关键尺寸

4

Cp Yield

Yield /良率

5

PR

Photo resist /光刻胶

6

STI

Shallow trench isolation /沟槽隔离（刻蚀工艺）

7

MFC

Mass Flow Controller /质量流量计

8

ADI

After develop inspection /显影后检查

9

AEI

After etch inspection/刻蚀后检查

10

CoO

Cost of Ownership /客户拥有成本

11

CoC

Cost of Consumables /消耗成本

12

MTBF

Mean Time Between Failure /平均故障间隔时间

13

MTTR

Mean Time To Repair /机台平均维修时间

14

MTBC

Mean Time Between Clean /平均清洗间隔时间

15

FECP

Field Equipment Change Procedure /设备合格认证流程

16

CE

Customer Engineer /客户硬件支持工程师

17

PSE

Process Support Engineer /客户工艺支持工程师

18

HCI

Hot Carrier Inject /热载流子注入测试

19

EFR

Early Failure Rate /早期失效率测试

20

HTOL

Hot Temperature Operation Life 168/500/1000 Hour test/

168/500/1000小时高温运行寿命测试

21

WPH

Wafer Per Hour /每小时加工的硅片数量