张洪潮，大连理工大学特聘教授，美国德克萨斯理工大学工业工程系教授，博导，现任大连理工大学机械来自工程学院可持续设计与制造研究所所长，从事可持续制造、绿色清360百科洗原理、产品全生命家掉此周期评价理论等研究工作。2010年5月受聘国家特聘专家。
1989年于丹麦技术大学机械制造专业获博士学位。
1990年8月―1995年8月策哥在美国德克萨斯理工大学，助胞酸理教授;1995年9月- 2000年8月在美国德克萨斯理工大学，副教授。
1998年4月―1998年5月应邀赴瑞士联邦理工学院机械工程系短期访问，客座教授。
球格没看 1998年6月―1998年7月应邀赴清华大学机械工程学院短期访问，客座教授。
1998年1月―1998年8月应邀赴丹麦技术大学机械工程学院短期访问，客座教授。
2000年―2006年任美国德克萨斯理工大学先进制造技术应用与研究中心主任。
2000年至今任美国促巴行细支院德克萨斯理工大学工业工程系教授病准顾乎去说。
2006年5月―2010年5月应邀赴合肥工业大学，任讲座教授。
2010年6月至今任大连理工大学特聘教授, 机械工程学院教授、博导。
社会兼职:
季所然进胶诗班数请 国际生产工程研究院 (CIRP)会员。
美国机械工程师协会 (ASME) FEL来自LOW。
美国每假乡且元盐跳免调把似电气和电子工程师协会 (IEEE) 会员。
工业工程师学会 (IIE) 高级会员。
制造工程师学会 (SME) 高级会杆在卷果员。
美国工程教育学会 (ASEE) 会员。
国际设计与流程学会 (SDPS) 奠基成员。
《International Journal of Sustainable Engineering》编委。
《Internat线假ional Journal of Sustainable Manufacturing》编委。
《International Journal of Advanced Manufacturing Technology》编委会顾问。
《IEEE Transacti360百科ons on Components, Packaging, and Manufacturing Technology》客座编辑。
《愿你地皇听县五IEEE Transactions on Robotics and Automation》、《IIE Transactions》客座编辑.。
1.基于传统金属切削的机床能耗分析。
2.机械装备(含工程机械、中重型载重工具及配它)的再制造修复技术。
3.纳米制备过程的能耗模型。
4.企业三维可持续力的评价。
5.面向再制造的绿不片依们破功光六色环保清洗技术。
6.面向产品全寿命周期的能耗分析。
1.CMMI - National Science Foundati州变破止好on，An Energy Factor Based Energy Saving Design Approach Thr来自ough Total Product Life Cycle。
2.EAGER - National Science Foundation (collaborate with Arizona State University)，A Super360百科critical Fluids Material Process Model for Recycling of Printed Circuit B倍家问景条物垂oards。
3. NIST National Institute o士f Standards and Technology，A Unified 黄知指歌室大眼速Sustainabil米步密玉主帝ity Measure Matri门双鸡模输防x for Electronic Industry。
4谈食.College of Engineering Texas Tech University，End-of-Life Pathways for Electro安nics – Comprehens须材短停相存位律视ive Case Studies。
5.Image Microsystems Inc., 探前毫品于会Austin, Texas，Collaborative research on Sustainable Manufacturing and Reverse Logistics。
6.ATC Logistics an很d Electronics, Inc.，Life Cycle Analysis for End-of-Life Set-top-box Refurbishing and recycling。
7.National Science Foundation of China (NSFC) Co-PI with Chinese research partners in China，International Collaboration on Sustainable Manufacturing。
8.Image Microsystems, Austin, Texas，殖速销践室充雷两还推Reverse Logistic Problems for Plastic Re迫耐色背县cycling。
9.National Science Foundation (Co-PI with PI from UTPA)，Application of ER Property of Car晚bon Nano-Tubes in Conductive Adhesives to Improve Conductivity, Reliability and Product Disassembly。
10.National Science Foundation (PI, with four industrial Co-PIs)，GOALI: A Re尔过表放百着突话verse logistic 你希富乡太证般否织老Business model for end-of- life electronic product recovery and recycling。
11.Advanced Research Program/ Advanced Technology Program of the Texa象和眼演卷延格s Higher Education Coordinating Board (PI)，A Pro渐运任请粉totype Model of Printed Circuit Boards Recycling Process。
12.Image Microsystems (PI)，End-of-Life Dell Computers Recovery and Recycling Management。
13.National Science Foundation (PI, collaborate with Che. Eng. and Dept. of Chemistry, TTU)，Exploratory Research: An Alternative Process Model For Printed Circuit Boards Recycling+ REU。
14.Teaching, Learning, and Technology Center Texas Tech University，Development of an Internet- Based Curriculum on Manufacturing Education for 21st Century。
15.Technology Development and Transfer program of the Texas Higher Education Coordinating Board (PI)，An Innovative Management System for End-of-Life Electronic Product Disassembly and Recycling。
16.2011年国家973项目"机械装备再制造的基础科学问题"相关科研工作。
1.Advanced Tolerancing Techniques (editing), John Wiley and Sons, Inc., New York, p. 588 1997 (H.C. Zhang)。
2.Computerized Manufacturing Process Planning Systems, Chapman and Hall, p. 326, London, 1993 (H.C. Zhang and L. Alting)。
[1]H. C. Zhang, & H. Li, "An Energy Factor Based Systematic Approach to Energy-saving Product Design," Annals of the CIRP, Vol. 60/2010, pp.183-186。
[2]John Carrel, Hong-Chao Zhang, and Hua Li, "Review and future of Active Disassembly for Electronics Products," the International Journal of Sustainable Engineering, Vol.2, No.4, pp. 252-264, 2009。
[3]Hua Li, Hong-Chao Zhang, and John Carrel, "Use of an Energy-Saving Concept to Assess Life-Cycle Impact in Engineering," the International Journal of Sustainable Manufacturing, Vol. 2, No. 1, pp. 99-111, 2009。
[4]John Carrell, Derrick Tate, Shiren Wang, and Hong-Chao Zhang, "Shape Memory Polymer Snap-Fits fro Active Disassembly," Journal of Cleaner Production, 2011, in press。
[5]Xueqing Qian, Hong-chao Zhang, "Design for Environment: An Environmentally Conscious Analysis Model for Modular Design" IEEE Transactions on Electronics Packaging Manufacturing, Vol. 32, No. 3, pp.164-175, 2009。
[6]Jianzhi Li, Hong-Chao Zhang, Zhangxi Lin, "Asymmetric negotiation based collaborative product design for component reuse in disparate products," Computers and Industrial Engineering, 2009, Vol. 57, No.1, pp.80-90。
[7]Lianzhi Li, Hong-Chao Zhang, Miguel A. Gonzalez,Steven Yu, "A multi-objective fuzzy graph approach for modular formulation considering end-of-life issues," International Journal of Production Research, Vol.46, No. 14 July, pp.4011 -4033,2008。
[8]J. Li, Z. Wu, H.C. Zhang, "Application of Neural Network on Environmental Impact Assessment Tools. The International Journal of Sustainable Manufacturing," Vol. 1, Nos. ?, pp.100-121, 2008。
[9]J. Li, H.C. Zhang, M. Gonzalez, S. Yu, "A Multi-objective Fuzzy Graph Approach for Modular Formulation Considering end-of-life Issues," The International journal of Production Research Vol. 46, No. 14 pp. 4011-4033, 2008。
[10]C. Yuan, H. C. Zhang, G. B. McKenna, C. Kozeniewski, "Experimental Studies on Cryogenic Recycling of Printed Circuit Board," The International Journal of Advanced Manufacturing Technology, Vol. 34, No. 7-8, pp. 657-666, 2007。
[11] D. Xiang, P. Meng,J. Wang, G. Duan, H. C. Zhang, "Printed Circuit Board Recycling Pocess and Its Environmental Impact Assessment," The International Journal of Advanced Manufacturing Technology, Vol. 34, No. 9-10, pp. 1030-1036, 2007。
[12]K. Jin, H.C. Zhang, "A decision support model based on a reference point method for end-of-life electronic product management," The International Journal of Advanced Manufacturing Technology, Vol. 31, No. 11-12, pp. 1251-1259, 2007。
[13]Q. Ke, H.C. Zhang, G. Liu, B. Li, "Energy-saving optimal design based on transfer function," The proceeding of The17th CIRP International Conference on Life Cycle Engineering, May 2010, Hefei, pp. 93-95。
[14]C. Fan, H.C. Zhang, "A review of sustainable manufacturing measurement from product life cycle perspective," Proceeding of The17th CIRP International Conference on Life Cycle Engineering, May 2010, Hefei, pp. 408-412。
[15]John Carrell, Hong-Chao Zhang, Derrick Tate, Bingbing Li, and Chengcheng Fan, "Design and Analysis of Shape Memory Polymer Snap-Fits for Active Disassembly," 17th CIRP International Conference on Life Cycle Engineering, 19-21 May 2010: Hefei, Anhui, P.R. China, 2010。
[16]John Carrell, Derrick Tate, and Hong-Chao Zhang, "Robust Analysis of Active Disassembly," International Symposium on Sustainable Systems and Technology, 19-21 May 2010: Washington, D.C. USA. 2010。
[17]John Carrel and Hong-Chao Zhang, "Review of Current End-of-Life Options for Electronics and Future Automatic Disassembly Options with Shape Memory Materials with Carbon Nano-tubes for Electronics," Proceedings of The15th CIRP International Conference on Life Cycle Engineering, March 2008, Sydney, pp. 470-475。
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